Chinese Institute of Engineers Seattle

Promoting Academic and Professional Excellence in the Asian Pacific American Community
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CIE Seattle
          Newsletter (2016 1H)
CIE Seattle promotes academic and professional excellence in the Asian Pacific American community through programs advancing innovation, collaboration and education:
Recognizing and Promoting Excellence
- “Seattle Luminary Award” recognizing global impact of local leaders
- Asian Pacific American Youth Scholarship Program

Supporting Collaboration and Professional Development
- Professional Development Seminar Series
- Annual CIE Seattle Convention and Seminar Series
- Community Summer Social

Enriching Education
- Student and Young Professionals Mentoring Program
- Asian Pacific American Youth Math and Science Contest
- “Bridging the Gap” University and College Lecture Series

Founded in 1961, CIE Seattle (“Chinese Institute of Engineers – Seattle”) is 501(c)(3) non-profit and a member of the CIE/USA National Council, which serves 10,000 CIE members and alumni nationwide.


Recent or Upcoming Events:

15th APA Youth Scholarship Program (Open 4/1/2017 to 6/20/2017)

To provide our contributions and commitment to the Asian Pacific American (APA) community, CIE/USA – Sea is proud to announce our 15th annual APA youth scholarship program. This motivational program designed to promote APA career interest in the fields of science, engineering, and technology. There are three award categories covering 7th graders to undergraduate college students. Application period begins April 1, 2017 and ends June 20, 2017.

Scholarship Program Announcement

Scholarship Program Details

Submit Online Application

Recommendation Letter Template

Frequent Asked Questions (FAQ)

2017 APCA Scholarship Program

APCA makes a difference in our community by supporting graduating high school seniors with their college education through our scholarship awards. APCA awards national scholarships to students residing in any state with a local APCA chapter. All students who apply will be considered for the national scholarships awards. Students who are not awarded national scholarships will be considered for state scholarships as supported by local APCA chapters.

Applicants must meet ALL of the following eligibility requirements:

  • All full-time graduating high school seniors in good academic standing (minimum unweighted GPA 3.40 on 4-point scale), of any ethnic or cultural background, who will attend an accredited college or university (2-year and 4-year) in Fall 2017.
  • Applicants who are United States citizens or permanent residents of the United States.
  • Applicants who are residents of one of the following states or metropolitan area where we currently have APCA chapters: Arizona, California, Colorado, Florida, Georgia, Hawaii, Illinois, Indiana, Michigan, Missouri, New Jersey, Ohio, Texas, Washington, Wisconsin, and the Washington, D.C. Metropolitan Area (Washington D.C., Maryland, and Virginia).
  • Students interested in applying will need to complete an application form that includes a student essay and provide one recommendation letter. Students who make it into the final round will also be required to send in an official high school transcript.

For answers to commonly asked questions, please refer to our FAQ page.



Past events of this year


2017 Asian American Engineer of the Year

2017 Asian American Engineer of the Year (AAEOY) Award is an annual award celebration held during National Engineers Week (E-week) and is the only national award program to pay tribute to Asian engineers, scientists and corporate leaders each year. The next coming award marks its 16th anniversary and will be held in the beautiful city of Bellevue from February 24-25, 2017.

Together with the award ceremony, there will be workshops, seminars and job fairs. Workshops, seminars and job fairs are open to the public. Everyone is welcome.


2016 APA Youth MathComp & ScienceFun

November 12, (Saturday), 2016

APA Youth MathComp and ScienceFun Competitions for this year will be held on the November 12th at the Interlake High School, Bellevue.  Registration for the program had already begun and the deadline is November 9, 2016.  For more details, please refer to the links below:

Program Flyer

Event Participant Online Registration

Event Volunteer Online Registration


August 20 (Sat), 2016


Congratulations to

2016 CIE/USA-Seattle APA Youth MathComp Winners


2016 Annual Convnetion & APA Youth Scolarship Award


2016 Award winners


Industry 4.0 - Digital Transformation of Industries

Keynote Speaker: Alex Jen

Boeing-Johnson Chair Professor and Chair

Dept. Materials Science & Engineering

University of Washington


Onsite events include afternoon seminars, evening banquet, scholarship awards and dance performance.  For more details, please refer to the event flyer below:

2016 Annual Convention Flyer

Event Registration & Membership


Afternoon Seminars Registration Only


April 30, 2016

Spring Technical Seminars
We are honored to host the spring technical seminar featuring Dr. Yan Wang of Microsoft on "Bring Intelligence to Cameras with an Image Search Engine" and Dr. Christopher Lum from the Department of Aeronautics & Astronautics, University of Washington on " Commercial and Civilian Applications of Unmanned Aerial Systems".  Please visit the following links for the event flyer and registration:

CIE-USA 4/30 Seminar Info

CIE-USA 4/30 Seminar Sign Up


April 01, 2016 to June 15, 2016 (opening period)

CIE-Seattle APA Youth Scholarship Program


A motivation program designed to promote APA youth career interest in the fields of STEM (Science, Technology, Engineering, and Mathematics). There are three award categories covering 7th graders to undergraduate college students with a total award amount of $4000.  Application period begins April 1, 2016 and ends June 15, 2016.  Please visit links below for more details:

Scholarship Program Announcement

Scholarship Program Details

Scholarship Program Flyer

Submit Online Application

Recommendation Letter Template

Frequent Asked Questions (FAQ)





CIE provides its offerings free or at low cost through the generous support of its valued partners, including: